l www.vishay.com vishay sfernice revision: 05-jun-12 1 document number: 53018 for technical questions, contact: sferthinfilm@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 smd wraparound ultra low value thin film resistors with extremely low resistance and high power capabilities, these ultra low value resistors are available with solderable or weldable terminations. features ?nicr + ta 2 o 5 resistive layer ? pre-soldered or gold terminations ? no inductance for high frequency applications ? alumina substrates for high power handling capability ? resistance range: 0.1 ? to 9.99 ? ? tcr down to 50 ppm/c ? power rating: up to 2 w at + 70 c ? withstand aec-q200 humidity test ? material categorization: for definitions of compliance please see www.vishay.com/doc?99912 note * lead (pb)-containing terminations are not rohs-compliant. exemptions may apply. note (1) with special assembly care note ? refer to application note g uidelines for vi shay sfernice resistive and inductive components (document number: 52029) for recommended reflow profile. profile #3 applies. standard electrical specifications model size resistance range ? rated power p 70 c w limiting element voltage v tolerance % temperature coefficient ppm/c l0603 0603 0.1 to 9.99 0.125 50 1, 3, 5 50, 100, 200, 300 l0805 0805 0.1 to 9.99 0.2 50 1, 3, 5 50, 100, 200, 300 l1206 1206 0.1 to 9.99 0.33 50 1, 3, 5 50, 100, 200, 300 l1505 1505 0.1 to 9.99 0.5 50 1, 3, 5 50, 100, 200, 300 l2010 2010 0.1 to 9.99 1.0 50 1, 3, 5 50, 100, 200, 300 l2512 2512 0.1 to 9.99 2.0 (1) 50 1, 3, 5 50, 100, 200, 300 climatic specifications operating temperature range - 55 c; + 155 c mechanical specifications substrate alumina technology nicr + ta 2 o 5 coating silicone terminations solderable b type: snpb over nickel barrier n type: snag over nickel barrier g type: gold over nickel barrier tolerance and tcr vs. ohmic value ohmic value range in ? tightest tolerance (%) best tcr (ppm/c) terminations 0r1 < 0r25 1 300 n or b 0r25 < 0r5 1 200 n or b 0r5 < 2r5 1 100 n or b 2r5 < 9r99 1 50 n or b 0r1 < 0r25 5 300 g 0r25 < 0r5 5 200 g 0r < 1r 5 100 g 1r < 2r5 3 100 g 2r5 to 9r99 3 50 g
l www.vishay.com vishay sfernice revision: 05-jun-12 2 document number: 53018 for technical questions, contact: sferthinfilm@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 option: enlarged terminations: 0063 for stringent and special power dissipation requirements, the thermal resistance between the resistive layer and the solder joi nt can be reduced using enlarged terminations chip resistors which are soldered on la rge and thick copper pads acting as heat sinks (see application note: power dissipati on in high precision vishay sfernice chip resistors and arrays (p thin film, pra arrays, chp thick film): www.vishay.com/doc?53048 ). for enlarged terminations: please consult vishay sfernice. option: aec-q200 withstanding please order option 0058. dimensions in millimeters (inches) case size abcd/e 0.152 ( 0.006) 0.127 ( 0.005) 0.127 (+ 0.005) 0.127 ( 0.005) 0603 1.52 (0.060) 0.85 (0.033) 0.5 (0.020) 0.38 (0.015) 0805 1.91 (0.075) 1.27 (0.050) 1206 3.06 (0.120) 1.60 (0.063) 0.40 (0.016) 1505 3.81 (0.150) 1.32 (0.052) 0.48 (0.019) 2010 5.08 (0.200) 2.54 (0.100) 2512 6.30 (0.248) 3.30 (0.129) suggested land pattern in millimeters (inches) (to ipc-7351a) case size z max. g min. x max. 0603 2.37 (0.093) 0.35 (0.014) 0.98 (0.039) 0805 2.76 (0.109) 0.74 (0.029) 1.40 (0.055) 1206 3.91 (0.154) 1.85 (0.073) 1.73 (0.068) 1505 4.66 (0.183) 2.44 (0.096) 1.45 (0.057) 2010 5.93 (0.233) 3.71 (0.146) 2.67 (0.105) 2512 7.15 (0.281) 4.93 (0.194) 3.43 (0.135) a b d e c x max. z max. g min.
l www.vishay.com vishay sfernice revision: 05-jun-12 3 document number: 53018 for technical questions, contact: sferthinfilm@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 power derating curve packaging several types of packaging ar e proposed: waffle-pack and tape and reel packaging rules waffle pack can be filled up to maximum qu antity indicated in the table here above, taking into acco unt the minimum order quantity. when quantity ordered exceeds maximum quantity of a single waffle pack, the waffle packs are stacked up on the top of each other and closed by one single cover. to get not stacked up waffl e pack in case of ordered quantity > maximum number of pieces per package: please consult vishay/sfern ice for specific ordering code . tape and reel can be filled up to maximum qu antity indicated in the table here above, taking into account the minimum order quantity. when quantity ordered is between the moq and the maximum reel capacity, on ly one reel is provided. when several reels are needed for ordered quantity within moq and maximum r eel capacity: please consult vishay sfernice for sp ecific ordering code . 070 20 40 60 80 100 120 140 155 0 20 40 60 80 100 ambient temperature in c rated power (%) size moq number of pieces per package tape width waffle pack 2" 2" tape and reel min. max. 0603 100 100 100 5000 8 mm 0805 4000 1206 140 1505 60 2010 2000 2512 45 performance tests conditions values and drift mil-r-55342 requirements typical performances thermal shock mil-r-55342 c mil-std-702, method 107 0.25 % 0.02 % short time overload mil-r-55342 c para 3.10.4.7.5 0.10 % 0.01 % low temperature operation mil-r-55342 c para 3.9 and 4.7.4 0.25 % 0.01 % resistance to solder heat mil-r-55342 c para 3.12, 4.7.7, 4.7.1.2 0.25 % 0.04 % moisture resistance mil-r-55342 c para 3.13 and 4.7.8 mil-std-202, method 106 0.40 % 0.01 % aec-q200 85 c/85 % rh/0.1 pn 1000 h - max. < 0.5 % + 0.05 ? high temperature mil-r-55342 c para 3.11 and 4.7.6 0.20 % 0.075 % load life mil-r-55342 c 2000 h pn at 70 c mil-std-202, method 108 0.50 % 0.15 %
l www.vishay.com vishay sfernice revision: 05-jun-12 4 document number: 53018 for technical questions, contact: sferthinfilm@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 note (1) for specific quantity of parts per packaging please consult vishay sfernice global part number information new global part numb ering: l0805k1r00fbt0099 global model size tcr value tolerance termination packaging (1) option l 0603 0805 1206 1505 2010 2512 h = 50 ppm k = 100 ppm l = 200 ppm m = 300 ppm r designated decimal point for values under 1r if 3 significant digits: rxxx if 2 significant digits: xrxx f = 1 % g = 2 % h = 3 % j = 5 % k = 10 % b : snpb over nickel barrier n : snag over nickel barrier g : gold over nickel barrier blank : waffle pack t : tape and reel leave blank if no option b : lead bearing version n and g : lead (pb)-free/ rohs version historical part number ex ample: l 0805 k 1r00 1 % b t r0099 l 0805 k 1r00 1 % b t r0099 model size tcr value tolerance termination packaging (1) option l0805k1r0 0fbt0 099
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